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Summary

Description
English: Cross-section SEM photo of SU-8 bonded wafers.
Date
Source M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006)
Author

Fraunhofer ENAS, D. Neumann

Uploaded by Enaswiki at en.wikipedia

Licensing

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Attribution: Fraunhofer ENAS
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  • 2011-03-30 11:20 (UTC) | Enaswiki | 815357 (bytes) | 2546×1995 | {{Information |Description = Cross-section SEM photo of SU-8 bonded wafers. |Source = M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |Date = 11:17, 30 March 2011 (UTC) |

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current12:24, 27 December 2011Thumbnail for version as of 12:24, 27 December 20112,546 × 1,995 (796 KB)SreeBot(Original text) : {{Information |Description = Cross-section SEM photo of SU-8 bonded wafers. |Source = M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |Date = 11:17, 30 M

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