Template:AMD Ryzen AI Mobile 300 series
Common features of Ryzen AI 300 notebook APUs:
- Socket: BGA, FP8 package type.
- All models support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
- All models support 16 PCIe 4.0 lanes.
- iGPU uses the RDNA 3.5 microarchitecture.
- NPU uses the XDNA 2 AI Engine (Ryzen AI).
- Both Zen5 and Zen5c cores support AVX-512 using a half-width 256-bit FPU.
- L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- Fabrication process: TSMC N4P FinFET.
| Branding and Model | CPU | GPU | NPU (Ryzen AI) |
TDP | Release date | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Cores (threads) | Clock (GHz) | L3 cache (total) |
Model | Clock (GHz) | ||||||||
| Total | Zen 5 | Zen 5c | Base | Boost[a] | ||||||||
| Ryzen AI 9 | HX 375 | 12 (24) | 4 (8) | 8 (16) | 2.0 | 5.1 | 24 MB | 890M 16 CUs |
2.9 | 55 TOPS | 15–54 W | July 17, 2024 |
| HX 370[2] | 50 TOPS | |||||||||||
| 365[2] | 10 (20) | 6 (12) | 5.0 | 880M 12 CUs | ||||||||
| Ryzen AI 7 | PRO 360[3] | 8 (16) | 3 (6) | 5 (10) | 5.1 | 8 MB | 870M | TBA | TBA | TBA | TBA | |
| PRO 160[4] | 4.2 | |||||||||||
Template documentation | Common place to discuss layout and style of the AMD APU tables at: Talk:List of AMD processors with 3D graphics. |
 | You can . |
References
- ^ Bonshor, Gavin. "The AMD Ryzen AI 9 HX 370 Review: Unleashing Zen 5 and RDNA 3.5 Into Notebooks". www.anandtech.com. Retrieved 2024-07-28.
- ^ a b Ganti, Anil (3 June 2024). "Computex 2024 | AMD Ryzen AI 9 HX 370 and Ryzen AI 9 365 unveiled with new CPU cores and GPU". NotebookCheck. Retrieved 3 June 2024.
- ^ Yuan, Gu (2024-07-06). "AMD Ryzen AI 9 HX 370/7 PRO 360 APU 跑分曝光". IT Home (in Simplified Chinese). Archived from the original on 2024-07-06. Retrieved 2024-07-08.
- ^ Klotz, Aaron (2024-07-05). "Ryzen AI 7 Pro 160 bests previous-gen Ryzen 9 — chip hits Geekbench with three Zen 5 and five Zen 5c cores". Tom's Hardware. Archived from the original on 2024-07-07. Retrieved 2024-07-08.